13.1 R10000 Single-Chip Package, 599CLGA

Thermal Characteristics

The 599CLGA incorporates a copper-tungsten slug to provide an efficient thermal path from the processor to the heatsink.

The thermal analysis listed in Table 13-2 gives a preliminary indication of heatsink requirements for the 599CLGA.

Table 13-2 R10000 599CLGA Thermal Characteristics - Preliminary

Revised Table 13-2.

System designers must take care, especially in desktop applications, to ensure sufficient airflow and heat-dissipation surface area to meet the required case-to-ambient thermal resistance, Qca.

The thermal interface between the package and heatsink is very important. Typically, grease or compliant material is inserted between the package and heatsink to increase the contact area between their surfaces.

Copyright 1996, 1997, MIPS Technologies, Inc. -- 09 DEC 96

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