The OCTANE workstation uses compression connectors to connect several modules and boards to the frontplane.
A single compression connector is used in the OCTANE workstation:
on the back of the PCI module
on each XIO board on the XIO module
Two compression connectors are used on the system module.
The compression connector has 96 pads that enable passage of signals between the system (via the frontplane) and the system module, PCI module, or XIO board.
The compression connector has two halves: One half is located on the frontplane of the chassis; the other, on the system module, PCI module, or XIO board. Each pad on a frontplane connector is a flat gold-plated surface. Each pad on the system module, PCI module, or XIO board is composed of hundreds of tiny bristles (dendrites). When a bristled pad is pressed into a gold-plated pad, a connection is created for one signal.
The bristled pads may attract and hold dust, lint, grease, powder, and dirt. The presence of these substances clogs or damages the bristles and prevents them from making proper contact with the gold-plated pads on the system's frontplane. It is import to prevent this.
To avoid damaging a compression connector and to keep it in optimal working condition, follow these guidelines whenever the board is not installed.
 | Caution: Failure to follow these instructions can result in irreparable damage to the surface of the connector's pads, which may result in intermittent or complete failure of the product. |
Do not wipe or touch the pads of the compression connector with anything (no human fingers, no brushes, no cloth, no probes), except as specified in the cleaning instructions. The bristles might be damaged.
Whenever the module or board is not in the chassis, put the protective cap over the compression connector and put the module or board in an antistatic bag. Make sure to close (fold over) the open end of the bag to minimize exposure to dust and atmospheric gases.
Do not put anything (not even water) onto the pads, except as specified in the cleaning instructions.
Before laying the board on a surface, make sure that the surface is free of dust, lint, powder, metal filings, oil, water, and so on.
Do not blow dust, dirt, or powder anywhere near the board when it is not inside its protective bag.
A compression connector should never need to be cleaned if you keep the protective cover on whenever the module or board is not in the chassis. However, if the connector becomes dirty, follow the instructions below for removing pollutants.
 | Note: Some pollutants can irreversibly damage (corrode or chemically alter) the pad surfaces. Although cleaning may remove the pollutant, it does not repair damage incurred by this contact. |
To remove pollutants, follow these instructions:
Obtain a can of dry compressed inert gas (for example, 100 percent pure nitrogen).
Caution: Do not use a cleaning product that contains any of the following ingredients: halogenated hydrocarbons, aromatic hydrocarbons, ethers, sulphur, ketones, or solvents of any kind. These substances cause irreparable damage to the connector's surface. Prepare the can for use, as instructed on the can. For example, if provided, attach the tube to the can's dispensing mechanism.
Hold the can so that the tip of the applicator is one to two inches away from the first row of pads at the topmost edge of the connector and at a slight angle so that the spray hits each pad and flows downward. You will be spraying at the pads on one row, but in the direction of the next row of pads. Do not allow the applicator to touch the pads.
Start spraying. As you spray, move the spray along the side of the connector until the entire first row has been sprayed. Move down to the next row.
Repeat until all the rows have been sprayed.