Appendix A. Specifications

This appendix provides the following information:

Physical and Performance Characteristics

Table A-1 summarizes the physical and performance characteristics for the copper board.

Table A-1. Copper Gigabit Ethernet Tech. Specs. - (1000Base-T) Adapters

Characteristic

Value

IEEE Standard / Network topology:

Gigabit Ethernet, 1000Base-T

Fast Ethernet, 100Base-TX

Ethernet, 10Base-T

Full duplex / Simplex

Supports both Simplex & Full duplex operation in all operating speeds

Auto negotiation:

Auto-negotiation between Full duplex and simplex operations and between 10Mb/s and 100Mb/s speeds and duplex 1000Mb/s speeds.

Data Transfer Rate:

 1000 Mbit/s, 100 Mbit/s, and 10 Mbits/sec in simplex mode per port.

2000Mbit/s 200 and 20 Mbit/s in full duplex mode per port.

Cables and Operating distance

10Base-T Category 3, 4, or 5 maximum 100m

100Base-Tx Category 5 maximum 100m

1000Base-T Category 5E maximum 100m

Table A-2 summarizes the physical and performance characteristics for the fiber-optic board.

Table A-2. Fiber-Optic Gigabit Ethernet Tech Specs. - (1000Base-SX) Adapters

Characteristic

Value

IEEE Standard / Network topology:

Fiber Gigabit Ethernet, 1000Base-SX (850nM)

Data Transfer Rate:

 2000Mbit/s in full duplex mode per port

Cables and Operating distance:

Multimode fiber:

220m at 62.5 um

550m at 50 um

Optical Output Power:

Typical: -6 dBm

Minimum: -9.5 dBm

Optical Receive Sensitivity:

Typical: -21 dBm

Maximum: -17 dBm


General Technical Specifications

This section describes general technical specifications for the copper board and fiber-optic board.

Copper Board Technical Specifications

Table A-3 provides the general technical specifications the copper boards.

Table A-3. Copper Board Gigabit Ethernet General Technical Specifications

Specification

Description

 Interface Standard:

 PCI Express Base Specification Revision 1.0

Board Size:

 Low profile Short PCI Add in card 167.74mm X 63.5 mm (6.6" X 2.5")

 PCI Express Card Type

X4 Lane

PCI Express Voltage:

+3.3V +-9%,

PCI Connector:

X4 Lane

Controllers:

Broadcom BCM5715C

Holder:

Metal Bracket

Weight:

80 gram (2.82 oz)

Power Consumption:

 1.97A at 3.3V: Typical, port operates at 1000Mbit/s.

1.31A at 3.3V: Typical, port operates at 100Mbit/s.

1.14A at 3.3V: Typical, port operates at 100Mbit/s.

1.23A at 3.3V: Typical, No link

Operating Humidity:

0% - 90%, non-condensing

Operating Temperature:

 0˚C - 50˚C (32˚F - 122˚F)

Storage:

-20˚C - 65˚C (-4˚F - 149˚F)

EMC Certifications:

 FCC Part 15, Subpart B Class B

Conducted Emissions

Radiated Emissions

CE EN 55022: 1998 Class B Amendments A1: 2000; A2: 2003

Conducted Emissions

Radiated Emissions

CE EN 55024: 1998 Amendments A1: 2000; A2: 2003

Immunity for ITE Amendment A1: 2001

CE EN 61000-3-2 2000, Class A

Harmonic Current Emissions

CE EN 61000 3-3 1995, Amendment A1: 2001

Voltage Fluctuations and Flicker

CE IEC 6100-4-2: 1995

ESD Air Discharge 8kV. Contact Discharge 4kV.

CE IEC 6100-4-3:1995

Radiated Immunity (80-1000Mhz), 3V/m 80% A.M. by 1kHz

CE IEC 6100-4-4:1995

EFT/B: Immunity to electrical fast transients 1kV Power

Leads, 0.5Kv Signals Leads

CE IEC 6100-4-5:1995

Immunity to conductive surges COM Mode; 2kV,

Dif. Mode 1kV

CE IEC 6100-4-6:1996

Conducted immunity (0.15-80 MHz) 3VRMS 80% A.M.

By 1kHz

CE IEC 6100-4-11:1994

Voltage Dips and Short Interruptions

V reduc >95%, 30% >95% Duration 0.5per, 25per, 250per

EMC Certifications:

CE EN 55022: 1998 Class B: Amendment A1 2000, A2 2003

  Conducted Emissions

  Radiated Emissions

CE EN 55024: 1998 Amendment A1: 2001, Amendment A2: 2003

  Immunity for ITE

CE EN 61000-3-2 2000

  Harmonic Current Emissions

CE EN 61000 3-3

  Voltage Fluctuations and Flicker

CE IEC 6100-4-2: 1995

  ESD Air Discharge 8kV. Contact Discharge 4kV.

CE IEC 6100-4-3:1995

  Radiated Immunity (80-1000Mhz), 3V/m 80% A.M. by 1kHz

CE IEC 6100-4-4:1995

  EFT/B: Immunity to electrical fast transients 1kV Power

  Leads, 0.5Kv Signals Leads

CE IEC 6100-4-5:1995

  Immunity to conductive surges COM Mode; 2kV,

Dif. Mode 1kV

CE IEC 6100-4-6:1996

  Conducted immunity (0.15-80 MHz) 3VRMS 80% A.M.

  By 1kHz

CE IEC 6100-4-11:1994

  Voltage Dips and Short Interruptions

  V educe >95%, 30% >95% Duration 0.5per, 25per, 250per

 

MTBF:

 213 (Years)

*According to Telcordia SR-332 Issue 1

Environmental condition ? GB (Ground, Fixed, Controlled). Ambient temperature - 25˚C. Temperature rise of 10˚C above the system ambient temperature was assumed for the cards components.

Table A-4 summarizes the LEDs and connector specifications for the copper board.

Table A-4. Copper Bord LEDs / Connector Specifications

Characteristic

Value

LEDs:

(3) LEDs per port

 Link Activity: Turns on any link speed, blinks on activity (green).

100Mbits/s: Turns on 100 Mbit/s link (green).

1000Mbit/s: Turn on 1000 Mbit/s link (green).

LEDs location:

 LEDs are located on the PCB, visible via holes in the metal bracket holder

Connectors:

(2) Shielded RJ-45


Fiber-Optic Board Technical Specifications

Table A-5 provides the general technical specifications for the fiber-optic board.

.

Table A-5. Fiber-optic Board Gigabit Ethernet General Technical Specifications

Specification

Description

 Interface Standard:

PCI Express Base Specification Revision 1.0

Board Size:

Low profile Short PCI Add in card 167.74mm X 63.5 mm (6.6" X 2.5")

 PCI Express Card Type

X4 Lane

PCI Express Voltage:

+3.3V +-9%

PCI Connector:

X4 Lane

Controllers:

Broadcom BCM5715S

Holder:

Metal Bracket

Weight:

90 gram (3.2 oz)

Power Consumption:

 1.55A at 3.3V: Typical, port operates at 1000Mbit/s.

1.5A at 3.3V: Typical, No link.

Operating Temperature:

 0˚C - 50˚C (32˚F - 122˚F)

Storage:

-20˚C - 65˚C (-4˚F - 149˚F

EMC Certifications:

 FCC Part 15, Subpart B Class B

  Conducted Emissions

  Radiated Emissions

EMC Certifications:

FCC Part 15, Subpart B Class B

Conducted Emissions

Radiated Emissions

CE EN 55022: 1998 Class B Amendments A1: 2000; A2: 2003

Conducted Emissions

Radiated Emissions

CE EN 55024: 1998 Amendments A1: 2000; A2: 2003

Immunity for ITE Amendment A1: 2001

CE EN 61000-3-2 2000, Class A

Harmonic Current Emissions

CE EN 61000 3-3 1995, Amendment A1: 2001

Voltage Fluctuations and Flicker

CE IEC 6100-4-2: 1995

ESD Air Discharge 8kV. Contact Discharge 4kV.

CE IEC 6100-4-3:1995

Radiated Immunity (80-1000Mhz), 3V/m 80% A.M. by 1kHz

CE IEC 6100-4-4:1995

EFT/B: Immunity to electrical fast transients 1kV Power

Leads, 0.5Kv Signals Leads

CE IEC 6100-4-5:1995

Immunity to conductive surges COM Mode; 2kV,

Dif. Mode 1kV

CE IEC 6100-4-6:1996

Conducted immunity (0.15-80 MHz) 3VRMS 80% A.M.

By 1kHz

CE IEC 6100-4-11:1994

Voltage Dips and Short Interruptions

V reduc >95%, 30% >95% Duration 0.5per, 25per, 250per

MTBF*:

 136 (Years)

*According to Telcordia SR-332 Issue 1

Environmental condition ? GB (Ground, Fixed, Controlled). Ambient temperature - 25˚C. Temperature rise of 10˚C above the system ambient temperature was assumed for the cards components (except for the optical transceivers). Temperature rise of 15˚C was assumed for the optical transceivers.

Table A-6 summarizes the LEDs and connector specifications for the fiber-optic board.

Table A-6. Fiber-Optic Bord LEDs / Connector Specifications

Characteristic

Value

LEDs:

(2) LEDs per port

Link: Turns on link (green).

Act: Blinks on activity (green).

LEDs location:

 LEDs are located on the PCB, visible via holes in the metal bracket holder

Connectors:

Small Form Factor (SFF) LC