PDP-11/45, 11/50, and 11/55 System Maintenance Manual

Company:Digital Equipment Corporation
Part:EK-11045-MM-007
Date:1976-09
Keywords:PDP-11/50 PDP-11/55

Table of Contents

  • Chapter 1 General Description
    • 1.1 Basic System Description
      • 1.1.1 Physical Characteristics
      • 1.1.2 General Power Requirements and Electrical Specifications
        • 1.1.2.1 Internal Option Power Requirements
        • 1.1.2.2 Determining Option Powr and Line Current Requirements
      • 1.1.3 H7420 Power Supply Characteristics
      • 1.1.4 H742 Power Supply Characteristics
      • 1.1.5 Voltage Regulator Characteristics
      • 1.1.6 Interface Specifications
      • 1.1.7 Environmental Specifications
    • 1.2 System Configurations and Options
    • 1.3 Expansion Cabinet Option
    • 1.4 Reference Documents
    • 1.5 Engineering Drawings
    • 1.6 Drawing Conventions
  • Chapter 2 System Installation
    • 2.1 General
    • 2.2 Site Preparation
      • 2.2.1 Physical Dimensions
      • 2.2.2 Fire and Safety Precautions
      • 2.2.3 Environmental Requirements
        • 2.2.3.1 Humidity and Temperature
        • 2.2.3.2 Air Conditioning
        • 2.2.3.3 Acoustical Damping
        • 2.2.3.4 Lighting
        • 2.2.3.5 Special Mounting Conditions
        • 2.2.3.6 Static Electricity
      • 2.2.4 Electrical Requirements
    • 2.3 Installation and Inspection
      • 2.3.1 Unpacking
      • 2.3.2 Inspection
      • 2.3.3 Cabinet Installation
      • 2.3.4 AC Power Connections
      • 2.3.5 Intercabinet Connections
        • 2.3.5.1 Unibus Connections
        • 2.3.5.2 Remote Power Connections
        • 2.3.5.3 Ground Strapping
        • 2.3.5.4 Wire Trough Cabling
    • 2.4 Initial Power Turn-On
    • 2.5 System Configuration Test Procedures
      • 2.5.1 Special Test Equipment
      • 2.5.2 Preliminary Checks
      • 2.5.3 Detailed Procedure
        • 2.5.3.1 RC Maintenance and Crystal Clock Test
        • 2.5.3.2 Microprogram ROM Cycle Test
        • 2.5.3.3 Single Time Start Test
        • 2.5.3.4 Single Time Step Test
        • 2.5.3.5 Switch Register and Display Test
        • 2.5.3.6 Internal Data Transfer Test
        • 2.5.3.7 Register Deposit/Examine Test
        • 2.5.3.8 I/O Data Transfer Test
        • 2.5.3.9 Unibus Test
        • 2.5.3.10 Fastbus Test
        • 2.5.3.11 ALU Arithmetic Test
        • 2.5.3.12 Unconditional Branch Test
        • 2.5.3.13 Register-to-Register Data Move Test
        • 2.5.3.14 Move-Immediatet-to-Register Test
    • 2.6 Customer Acceptance
  • Chapter 3 Power System
    • 3.1 Overall System Description
    • 3.2 115 Vac and 230 Vac Models
    • 3.3 Difference Power System Versions
  • Chapter 4 AC Power Distribution
    • 4.1 Primary AC Power Outlets
      • 4.1.1 Primary AC Power Outlets, 861 Power Control
      • 4.1.2 Primary AC Power Outlets, 860 Power Controls
    • 4.2 AC Power Control
      • 4.2.1 Remote Power Connections
      • 4.2.2 Power Controllers
        • 4.2.2.1 861 Power Controls
        • 4.2.2.2 860 Power Controls
        • 4.2.2.3 Switch 860 Power Controls
        • 4.2.2.4 Unswitched 860 Power Control
    • 4.3 Backup AC Power Source for Semiconductor Memory
    • 4.4 AC Power Distribution
  • Chapter 5 DC Power Distribution
    • 5.1 DC Power Distribution
      • 5.1.1 Power Distribution Cable Harnesses
      • 5.1.2 Backplane Power Distribution
    • 5.2 DC Power Supplies
      • 5.2.1 AC Input/Output
      • 5.2.2 Power Control Boards
        • 5.2.2.1 5411086 Power Control Board
        • 5.2.2.2 5409730 Power Control Board
      • 5.2.3 H744 +5 V Regulator
      • 5.2.4 H745 -15 V Regulator
      • 5.2.5 H746 MOS Regulator
      • 5.2.6 H754 +20, -5 V Regulator
  • Chapter 6 Maintenance
    • 6.1 Maintenance Equipment Required
    • 6.2 Preventive Maintenance
      • 6.2.1 Physical Checks
      • 6.2.2 Electrical Checks and Adjustments
        • 6.2.2.1 Regulator Voltage Checks
        • 6.2.2.2 Power Control
        • 6.2.2.3 AC Power Connector Receptacles
      • 6.2.3 Timing Margins
      • 6.2.4 General Diagnostic Testing
    • 6.3 Power System Maintenance
      • 6.3.1 Circuit Tracing
      • 6.3.2 Visual Aids to Troubleshooting
      • 6.3.3 Voltage Regulator Test Procedures
        • 6.3.3.1 Initial Tests
        • 6.3.3.2 Output Short-Circuit Tests
        • 6.3.3.3 Testing a "Dead" Regulator
        • 6.3.3.4 Testing a Voltage Regulator After Repairs
      • 6.3.4 H7420 Power Supply Subassembly Removal and Installation Procedures
        • 6.3.4.1 Power Supply Access Procedure
        • 6.3.4.2 H744 Regulator Removal
        • 6.3.4.3 H744 Regulator Installation
        • 6.3.4.4 5411086 15 V Regulator/Power Line Monitor Board Removal
        • 6.3.4.5 6411086 15 V Regulator/Power Line Monitor Board Installation
    • 6.4 CPU Maintenance
      • 6.4.1 KB11-A, D CPU Diagnostics
    • 6.5 How to Use Maintenance Cards
      • 6.5.1 Clock Selection
      • 6.5.2 Maintenance Mode Control
        • 6.5.2.1 Single ROM Cycle
        • 6.5.2.2 µPB STOP
        • 6.5.2.3 Single Step
      • 6.5.3 Using the Maintenance Card with KB11-A, D
        • 6.5.3.1 Deposit Test Instruction
        • 6.5.3.2 µPB STOP MODE
        • 6.5.3.3 Single ROM Cycle Mode
        • 6.5.3.4 SING TP Mode
    • 6.6 How To Use the W900 Module Extenders
    • 6.7 Module and Assembly Removal and Replacement
      • 6.7.1 Module Removal and Replacement
      • 6.7.2 Console Disassembly
    • 6.8 Removal and Replacement of ICs
      • 6.8.1 Location of ICs
      • 6.8.2 IC Connections
      • 6.8.3 IC and Component Removal and Replacement
        • 6.8.3.1 Removal and Replacement of Plastic Case ICs
        • 6.8.3.2 Removal and Replacement of Ceramic ICs
      • 6.8.4 Solder Mask Removal
    • 6.9 Special MOS Handling Procedures
    • 6.10 Equipment Configuration and Revision Status
      • 6.10.1 Mechanical Status Sticker
      • 6.10.2 ECO Status Sticker
      • 6.10.3 Module ECOs
      • 6.10.4 Module Utilization List (MUL) Sticker
  • Chapter 7 Plug-In Card Options
    • 7.1 FP11-B, C Floating-Point Processor
      • 7.1.1 Installation
    • 7.2 FP11 Diagnostics
      • 7.2.1 FP11-B Diagnostics
      • 7.2.2 FP11-C Diagnostics
      • 7.2.3 Using the Maintenance Card with the FP11-B, C
        • 7.2.3.1 FPP Test Timing
      • 7.2.4 FP11-B, C Floating-Point Processor Procedures
        • 7.2.4.1 Time Margining of the FP11-B
        • 7.2.4.2 Time Margining of the FP11-C
        • 7.2.4.3 Special Maintenance Instructions of the FP11-B
        • 7.2.4.4 Special Maintenance Instructions of the FP11-C
        • 7.2.4.5 Maintenance Instruction Programming Example
        • 7.2.4.6 Console Display Features
    • 7.3 KT11-C, CD Memory Management Unit
      • 7.3.1 Installation
      • 7.3.2 Diagnostics
    • 7.4 MS11 Semiconductor Memory
      • 7.4.1 Installation
        • 7.4.1.1 Semiconductor Memory Jumper Connections
        • 7.4.1.2 Installation of Bipolar Memory
        • 7.4.1.3 Installation of MOS Memory (MS11-B)
        • 7.4.1.4 Installation of Both MOS and Bipolar Memory
      • 7.4.2 Semiconductor Memory Calibration
      • 7.4.3 Diagnostics
    • 7.5 KW11-L Line Clock
  • Chapter 8 System Unit Options
    • 8.1 System Units
    • 8.2 Expansion Cabinets
    • 8.3 DC Power Distribution
      • 8.3.1 CPU Cabinet
      • 8.3.2 Expansion Cabinets
    • 8.4 MF11 Core Memory
    • 8.5 Installation of System Unit
  • Appendix A IC Descriptions
  • Appendix B Peripheral Preventive Maintenance Schedule
  • Appendix C Summary of Equipment Specifications

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